Technology management. Design and manufacture of a heatsink

Vista sencilla de ítem
dc.contributor.authorMontesinos-González, Salvador
dc.contributor.authorVázquez-Cid-de León, Carlos
dc.contributor.authorDomínguez-Herrera, José Ernesto
dc.contributor.authorPalafox-Alvarado, Gerardo Israel
dc.date.accessioned2023-06-27T17:02:55Z
dc.date.available2023-06-27T17:02:55Z
dc.date.issued2023-04
dc.descriptionilustraciones, diagramasspa
dc.description.abstractThe main purpose of this research is to study and analyze the management of technology and innovation through the manufacture of a heatsink is manufactured for IGBT power transistors to fit a CD/CD converter. This work consists of four stages: planning, design, modelling and manufacturing. It is assumed that the manufacture of an innovative product requires guaranteeing customer satisfaction, like functional criteria (requirements) were defined like in decrease the temperature to less than 50 °C, heat dissipation is realised by natural convection or forced convection. Non-functional criteria, like easy transport with a weightless than 2.5 kg, dimensions less than 0.32 m long, 0.217 m wide and 0.09 cm high. Besides, the conditioned material is copper or aluminium or the use of both. To achieve this, Pugh's methodology was used.eng
dc.description.abstractEl objetivo principal de esta investigación es estudiar y analizar la gestión de la tecnología y la innovación a través de la fabricación de un disipador térmico para transistores de potencia IGBT que se adapten a un convertidor CD/CD. Este trabajo consta de cuatro etapas: planificación, diseño, modelado y fabricación. Se asume que la fabricación de un producto innovador requiere garantizar la satisfacción del cliente, ya que se definieron criterios funcionales (requisitos) como en disminuir la temperatura a menos de 50 ° C, la disipación de calor se realiza por convección natural o convección forzada. Criterios no funcionales, como fácil transporte con un peso inferior a 2,5 kg. dimensiones inferiores a 0,32 m de largo, 0,217 m de ancho y 0,09 cm de alto. Además, el material acondicionado es cobre o aluminio o el uso de ambos. Para lograrlo, se utilizó la metodología de Pugh. (Texto tomado de la fuente)spa
dc.description.notesReceived: August 8th, 2022. Received in revised form: January 11th, 2023. Accepted: January 13th, 2023eng
dc.format.extent8 páginasspa
dc.format.mimetypeapplication/pdfspa
dc.identifier.eissnISSN 2346-2183spa
dc.identifier.instnameUniversidad Nacional de Colombiaspa
dc.identifier.issnISSN 0012-7353spa
dc.identifier.reponameRepositorio Institucional Universidad Nacional de Colombiaspa
dc.identifier.repourlhttps://repositorio.unal.edu.co/spa
dc.identifier.urihttps://repositorio.unal.edu.co/handle/unal/84084
dc.language.isoengspa
dc.publisherUniversidad Nacional de Colombiaspa
dc.publisher.departmentArtículos de Revistasspa
dc.publisher.placeMedellín, Colombiaspa
dc.relation.citationedition226 (Abril-junio 2023)spa
dc.relation.citationendpage16spa
dc.relation.citationissue226spa
dc.relation.citationstartpage9spa
dc.relation.citationvolume90spa
dc.relation.indexedRedColspa
dc.relation.indexedLaReferenciaspa
dc.relation.ispartofjournalDYNAspa
dc.relation.references[1]Harper, C.A., Electronic Packaging and Interconnection Handbook. 4th ed., McGraw-Hill, New York, 2005, pp. 50-61spa
dc.relation.references[2]Bar-Cohen, A., Wang, P. and Rahim, E., Thermal Management of high heat flux nanoelectronic chips. Z-Tec Publishing, Bremen Microgravity Science and Technology, 19(3), pp. 48-52, 2007. DOI: https://doi.org/10.1007/BF02915748spa
dc.relation.references[3]Chitode, J.S., Industrial Electronics. 1st ed., India: Technical Publications, 2009, pp. 80-114.spa
dc.relation.references[4]Šprlák, R., Kalvar, D. and Chlebiš, P., Design of experimental liquid heat sink for high power electronic. 14th International Conference on Environment and Electrical Engineering, pp. 83-105, 2014. DOI: https://doi.org/10.1007/978-90-481-9029-4_5spa
dc.relation.references[5]Thome, J. and Consolini, L., Prediction of critical flux in microchannels. Microfluidics Based Microsystems: Fundamentals and applications, pp. 107-120, 2010. DOI: https://doi.org/10.1007/978-90- 481-9029-4_6spa
dc.relation.references[6]Dang, T., Teng, J.T. and Chu, J.C., A study on the simulation and experiment of a microchannel counterflow. Applied Thermal Engineering, 30(14), pp. 2163-2172, 2010. DOI: https://doi.org/10.1016/j.applthermaleng.2010.05.029spa
dc.relation.references[7]Kosar, A., Effect of substrate thickness and material on heat transfer. International Journal of Thermal Sciences, 49(4), pp. 635-642, 2009. DOI:https://doi.org/10.1016/j.ijthermalsci.2009.11.004spa
dc.relation.references[8]Seal, S., Glover, M. and Mantooth, H.A., Design of a Reduced form factor passive heat sink for high power applications, IEEE International Workshop on Integrated Power Packaging (IWIPP), pp. 44-47, 2015. DOI: https://doi.org/10.1109/IWIPP.2015.7295974spa
dc.relation.references[9]Steiner, T. and Sittig, R., IGBT Module Setup with Integrated Micro-Heat Sinks. IEEE 12th International Symposium on Power Semiconductor Devices and ICs. Proceedings (Cat. No. 00CH37094, pp.209-212, 2000. DOI: https://doi.org/10.1109/ISPSD.2000.856808spa
dc.relation.references[10]Holman, J.P., Heat transfer. 10th ed. McGraw-Hill, New York, 2009, pp. 190-215.spa
dc.relation.references[11]Christen, D., Member, S., Stojadinovic, M., Member, S. and Senior, J.B., Energy Efficient Heat Sink Design: Natural vs Forced Convection Cooling, IEEE Transactions on Power Electronics, 32(11), pp.8693-8704, 2016. DOI: https://doi.org/10.1109/TPEL.2016.2640454spa
dc.relation.references[12]Han, M., Leet, S., Hong, C., Yang, C. and Kim, K., Development of water-cooled heat sink for high-power IGBT inverter, IEEE 7ª International Conference on Power Electronics, 2008, pp. 295-299. DOI: https://doi.org/10.1109/ICPE.2007.4692396spa
dc.relation.references[13]Robinson, A.J., A Thermal–Hydraulic Comparison of Liquid Microchannel and Impinging Liquid Jet Array Heat Sinks for High-Power Electronics Cooling, IEEE Transactions on Components and Packaging Technologies, 32(2), pp. 347-357, 2009. DOI: https://doi.org/10.1109/TCAPT.2008.2010408spa
dc.relation.references[14]Gillot, C., Meysenc, L., Schaeffer, C. and Bricard, A., Integrated single and two-phase micro heat sinks under IGBT chips, IEEE Transactions on Components and Packaging Technologies, 22(3), 1999. DOI: https://doi.org/10.1109/6144.796540spa
dc.relation.references[15]Marinov, A. and Georgiev, A., Modelling, Analysis and comparison of heat sink designs with improved natural convection, in: IEEE 19th International Symposium on Electrical Apparatus and Technologies (SIELA), 2016, pp. 1-4, DOI: https://doi.org/10.1109/SIELA.2016.7543023spa
dc.relation.references[16]Zainolarifin, M., Hanafi, M., Ismail, F.S. and Rosli, R., Radial plate fins heat sink model design and optimization, in: IEEE 10th Asian Control Conference (ASCC), 2015, pp 1-5. DOI: https://doi.org/10.1109/ASCC.2015.7244448spa
dc.relation.references[17]Asimakopoulos, P., Papastergiou, K., Thiringer, T. and Bongiorno, M., Heat sink design considerations in medium power electronic applications with long power cycles, in: IEEE 17th European Conference on Power Electronics and Applications (EPE'15 ECCE-Europe), 2015, pp. 1-9. DOI: https://doi.org/10.1109/EPE.2015.7309150spa
dc.relation.references[18]Welker, T. and Müller, J., Design, simulation and fabrication of liquid cooled LTCC devices utilizing integrated channels, IN: 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016, pp. 830-385. DOI: https://doi.org/10.1109/ITHERM.2016.7517632spa
dc.relation.references[19]Manivannan, S., Prasanna, S., Arumugam, R. and Sudharsan, N.M., Multi-objective optimization of flat plate heat sink. International Journal of Advanced Manufacturing Technolgy, 52, pp. 739-749, 2010. DOI: https://doi.org/10.1007/s00170-010-2754-8spa
dc.relation.references[20]Popovic, J., Milanovic, M., Dolinar, D. and Klopcic, B., Thermal analysis of the half-bridge IGBT power module with analytical, numerical and experimental methods. Przeglad Electrotechniczny (Electrical Review), 87(3), pp.145-148, 2011.spa
dc.relation.references[21]Pugh, S., Total design: integrated methods for successful product engineering. 1st ed., Addison Wesley, E.U., 1991, pp. 20-25.spa
dc.relation.references[22]Palafox, G.I., Design and manufacturing of a heat sink for IGBT power transistors. Thesis MSc, Technological University of the Mixteca, Huajuapan de León, Oax., Mexico, 2017, pp. 10-60.spa
dc.relation.references[23]Bergman, T., Lavine, A., Incropera, F. and DeWitt, D.,Fundamentals of heat and mass transfer. 7th ed., Wiley, E.U.,2011, pp. 30-32.spa
dc.relation.references[24]Groover, M., Fundamentals of Modern Manufacturing:Materials, Processes, and Systems. 5th ed., Mc Graw-Hill, E.U., 2012, pp. 30-32.spa
dc.relation.references[25]Kalpakjian, S. and Schmid, S.R., Manufacturing Engineeringand Technology. 7th ed., Prentice Hall, E.U., 2014, pp. 57-59spa
dc.rights.accessrightsinfo:eu-repo/semantics/openAccessspa
dc.rights.licenseAtribución-NoComercial-SinDerivadas 4.0 Internacionalspa
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/spa
dc.sourcehttps://revistas.unal.edu.co/index.php/dyna/article/view/104063/88607spa
dc.subject.ddc620 - Ingeniería y operaciones afines::629 - Otras ramas de la ingenieríaspa
dc.subject.proposalManagementeng
dc.subject.proposalDesingeng
dc.subject.proposalManufactureeng
dc.subject.proposalConventioneng
dc.subject.proposalHeatsinkeng
dc.subject.proposalGestiónspa
dc.subject.proposalDiseñospa
dc.subject.proposalManufacturaspa
dc.subject.proposalDisipador de calorspa
dc.subject.proposalConvenciónspa
dc.titleTechnology management. Design and manufacture of a heatsinkeng
dc.title.translatedGestión Tecnológica. Diseño y manufactura de un disipador de calor
dc.typeArtículo de revistaspa
dc.type.coarhttp://purl.org/coar/resource_type/c_6501spa
dc.type.coarversionhttp://purl.org/coar/version/c_970fb48d4fbd8a85spa
dc.type.contentTextspa
dc.type.driverinfo:eu-repo/semantics/articlespa
dc.type.redcolhttp://purl.org/redcol/resource_type/ARTOTRspa
dc.type.versioninfo:eu-repo/semantics/publishedVersionspa
dcterms.audience.professionaldevelopmentPúblico generalspa
oaire.accessrightshttp://purl.org/coar/access_right/c_abf2spa

Archivos

Bloque original

Mostrando 1 - 1 de 1
Miniatura
Nombre:
TECHNOLOGY MANAGEMENT. DESIGN AND MANUFACTURE OF A HEATSINK.pdf
Tamaño:
1.46 MB
Formato:
Adobe Portable Document Format
Descripción:
Descargar

Bloque de licencias

Mostrando 1 - 1 de 1
Miniatura
Nombre:
license.txt
Tamaño:
5.74 KB
Formato:
Item-specific license agreed upon to submission
Descripción:
Descargar

Colecciones

Artículos de Revistas